End-to-End Services. 100% U.S. Based
A Supplier
You Can Trust
Over 40 years of helping hundreds of customers bring innovative products to market, we know how to take a wafer and turn it into a tested product.
Accelerated Time
To Market
By keeping all your processes in the U.S. and dealing with just one supplier, you can get to market faster — ahead of your competitors.
Lower Costs &
Higher Returns
Thanks to our complete, in-house services, you get to streamline vendor communication, minimize packaging and testing costs, and enjoy a higher ROI.
Full Turnkey Semiconductor Test & Assembly Services
Die Prep - Assembly - Test & Qualification
Die Prep
Offering 100% US-Based, End-to-End Solutions for All Your Die Preparation Needs
- Wafer Thinning
- Wafer Dicing
- Pick & Place
- Die Inspection
Packaging & Assembly
Helping Customers Introduce Their New Products to the Market in the Fastest Time
- SiP/MCM
- Die Attach
- Standard IC Packages
- Flip-Chip Interconnect
- Encapsulation
Electrical Test
Largest Test Engineering Group with 25+ Test Dev. Engineers & 30+ Total Technical Staff
- Total Test
- Device Up-Screening
- Wafer Probe
- Singulated Die Probe
- Custom ASIC/FPGA
Reliability & Qualification
Industry Leader in Providing Qualification, Design Verification and Reliability Testing
- PEM Qualification
- Cu Wire Evaluation
- ESD Services
- CGA Interconnect
- Burn In, Temp Cycling & Thermal Shock
DPA & FA
Fully Capable SEM, Mechanical, Metallurgical and Specialty Lab
- Destructive Physical Analysis
- Failure Analysis
- Laser Ablation
Counterfeit Detection
Quick-Turn Times, Competitive Prices and Superior Customer Service
- Counterfeit Detection
- Obsolescence Management
- BOM Management
- Parts Management Program (PMP)
Local Support… Worldwide
Operations, Engineering, & Field Support
The Largest U.S. OSAT Company Providing
Secure, Reliable, State-of-the-Art Semiconductor
Services with Unwavering Integrity
