Destructive Physical Analysis (DPA), Failure Analysis (FA) and Construction Analysis (CA)

Fully Compliant DPADPA | FA | CA Analysis Testing

•  Per Mil-Std-1580 DPA (B and S Level)

•  Per NASA SSQ25000

Types of Analysis

•  Destructive Physical Analysis

•  Failure Analysis

•  Construction Analysis

•  New Designs, Products and Processes

•  Wafer Fabrication 

•  Packaging 

•  Assemblies

Competitor Bench-Marking

Qualification Failures

Low Yield Analysis

Field Failures / Returns / System Failures

Counterfeit DetectionDestructive Physical Analysis | Failure Analysis | Construction Analysis

Services Include:

•  SEM Inspections

•  Backscattered Electron Imaging

•  Material Identification

•  EBIC Failure Isolation

•  Static Voltage Contrast

•  Dynamic Voltage Contrast

•  Electron Beam Probing

•  Crystallographic Defect Isolation

•  SEM Photo to GDSII Conversion

•  On Chip Die Modification

•  Insulator/Metal Deposition

•  Precision Cross Sections 

•  High Resolution Imaging

•  SCM and SRM Imaging

•  Failure Site Isolation

•  Dielectric Luminescence/Thermal Radiation

•  Circuit Isolation

•  PEM Non-invasion Inspections

•  Hermetic Non-invasive Inspections

•  Delamination \ Voiding  Detection

•  Up-Screening Inspections / Qualification Testing

 

 

Contact Us

Integra Technologies - Wichita
Semiconductor Development & Test Services 

3450 N. Rock Road, Building #100
Wichita, KS USA 67226 

Sales: (800) 622-2382

Main#: (316) 630-6800
Fax: (316) 630-6877

 

Analytical Solutions - Albuquerque
DPA & FA Services

10401 Research Rd. SE,
Albuquerque NM, 87123

Sales - (800) 622-2382

Technical Support - (505) 299-1967
Fax: (505) 292-0225 

 

Contact Our Team

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