Destructive Physical Analysis (DPA), Failure Analysis (FA) and Construction Analysis (CA)
Fully Compliant DPA
• Per Mil-Std-1580 DPA (B and S Level)
• Per NASA SSQ25000
Types of Analysis
• Destructive Physical Analysis
• Failure Analysis
• Construction Analysis
• New Designs, Products and Processes
• Wafer Fabrication
• Packaging
• Assemblies
Competitor Bench-Marking
Qualification Failures
Low Yield Analysis
Field Failures / Returns / System Failures
Counterfeit Detection
Services Include:
• SEM Inspections
• Backscattered Electron Imaging
• Material Identification
• EBIC Failure Isolation
• Static Voltage Contrast
• Dynamic Voltage Contrast
• Electron Beam Probing
• Crystallographic Defect Isolation
• SEM Photo to GDSII Conversion
• On Chip Die Modification
• Insulator/Metal Deposition
• Precision Cross Sections
• High Resolution Imaging
• SCM and SRM Imaging
• Failure Site Isolation
• Dielectric Luminescence/Thermal Radiation
• Circuit Isolation
• PEM Non-invasion Inspections
• Hermetic Non-invasive Inspections
• Delamination \ Voiding Detection
• Up-Screening Inspections / Qualification Testing
