Integra offers a complete suite of singulated die probing and testing services!

Bare die testing is essential for optimizing yields in the following applications:

  • Multi-Chip Modules
  • System in Package
  • Die Reclamation and Repackaging
  • Hybrid Microcircuits

Integra die probing and testing capabilities include:

  • Die pad-counts from 2 to 8,000+
  • Temperatures from -55ºC to +125ºC
  • Device complexities from simple discretes to complex FPGAs & Microprocessors
  • Device speeds of 40GHz+
  • Minimal probe marks on pad
  • Precise micro manipulation for X, Y, Z and θ adjustment

Die Probe Interface

Typical High Pin Count Die Probe Interface

Contact Us

Integra Technologies - Wichita
Semiconductor Development & Test Services 

3450 N. Rock Road, Building #100
Wichita, KS USA 67226 

Sales: (800) 622-2382

Main#: (316) 630-6800
Fax: (316) 630-6877

 

Analytical Solutions - Albuquerque
DPA & FA Services

10401 Research Rd. SE,
Albuquerque NM, 87123

Sales - (800) 622-2382

Technical Support - (505) 299-1967
Fax: (505) 292-0225 

 

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