ASI Service offering includes:

  • 3D X-Ray Inspection
  • Backside Inspection
  • Destructive Physical Analysis (DPA)
  • Failure Analysis (FA)
  • External Visual Inspection - This non-destructive test method is used to verify lot conformance to Military Standards or customer supplied paperwork. While this is the first step in most analyses it can be utilized as a standalone analysis of flight parts to ensure quality issues don’t exist that would result in reliability or manufacturability issues. Typical inspections include mechanical measurement of devices to ensure they are processed to the device specification or to identify any indicators of counterfeited parts. In addition, a detailed inspection may reveal reliability issues such as finish plating, lid and lead welds, lead conditions, cracked chipped or broken packages, and conformance to markings standards. ASI is DLA/DSCC suitable for inspections per MIL-STD-883 Method 2009.
  • X-Radiography Inspection - X- Radiographic inspection can be utilized on a single component or a completed assembly to verify build quality and identify quality and reliability issues that may affect the expected life of the product. Component level screening allows customers to screen out defects that have occurred during the manufacturing of the parts. Inspection areas include wire bond formation and sweep, lid seal, consistency of build, die attachment to header or substrate, and have been useful to identify changes in die size either resulting from a manufacturer’s die shrink or dissimilar parts being sold as a contiguous lot. ASI is DLA/DSCC suitable for inspections per MIL-STD-883 Method 2012.
  • Particle Impact Noise Detection (PIND) - PIND is performed on package constructions that have a designed cavity to determine if loose particles exist within the cavity of the device. These small particles have been attributed to shorts during device operation resulting in catastrophic failure of components in systems. Particles may either be introduced during product build or have been introduced by plating issues of the lid resulting in flakes large enough to bridge the distance between non-common electrical connections. ASI is DLA/DSCC suitable for PIND testing per MIL-STD-883 Method 2020 Conditions A and B.
  • Fine and Gross Seal Testing - Seal testing is performed to ensure hermetic parts have a proper seal to maintain the internal environment of the package. ASI is DLA/DSCC suitable for Fine and Gross Seal test per MIL-STD-883 Method 1014 conditions A1, A2 and C1. 
    Fine seal testing is performed utilizing Helium as the tracer gas and a helium detector to verify the parts meet an acceptable leak rate. Parts are pressurized in a chamber utilizing helium gas for a specified period of time and then tested in the helium detector once pressurization cycle is complete. 
    Gross seal testing is performed utilizing a Perfluorocarbon detector indicator fluids to determine if seal issues exist. Parts are submerged in the detector fluid and pressurized for a period of time to force the fluid into the cavity of the device. Once parts have completed this step they are placed in a hot bath of indicator fluid and inspection for outgassing is performed. 
    Dye Penetrant testing is performed utilizing a fluorescent dye. Devices are pressurized in a bath of the fluorescent dye for a specified period of time and then cleaned and inspected under an appropriate light source to identify paths that may reach the internal cavity of the device and create opportunities for contamination or corrosion of active elements.
  • X-Ray Fluorescence (XRF) - XRF is performed for material identification and plating thickness measurements. This technique is useful for determining plating meets the requirements of device specifications and is used for quality control of production. This technique has been utilized to verify proper plating thickness has been achieved on devices without the need for more destructive measures such as cross section and Scanning Electron Microscopy imaging and measurements. In addition, this tool is actively utilized to ensure finish materials conform to device specifications to mitigate tin-whisker growth and counterfeit part incursion.
  • Scanning Acoustic Microscopy (SAM) - SAM is primarily used to verify proper bonding of materials in molded packages, voiding of molding compound or die attach and cracks in elements. Poorly bonded molding compound to the lead frame or active element of the die allows moisture ingress which can result in ionic contamination and corrosion of the active element of the component. Voiding in molding compound can result in pop corning of packaging during reflow of components on to the final assembly. Excessive voiding in die attach can result in poor electrical or heat transfer from the active element to the lead frame. While the primary use identifies packaging related issues the technique is very flexible and can be utilized to obtain measurements of materials of known acoustic impedance, changes in material due to overstress, or changes in material due to re-marking of parts.

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Integra Technologies - Wichita
Semiconductor Development & Test Services 

3450 N. Rock Road, Building #100
Wichita, KS USA 67226 

Sales: (800) 622-2382

Main#: (316) 630-6800
Fax: (316) 630-6877


Analytical Solutions - Albuquerque
DPA & FA Services

10401 Research Rd. SE,
Albuquerque NM, 87123

Sales - (800) 622-2382

Technical Support - (505) 299-1967
Fax: (505) 292-0225 


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