Integra Technologies LLC provides semiconductor production testing (wafer probe and final test), qualification, and related technical services to manufacturers and users of semiconductor devices.  In business for more than 30 years, we serve the Fabless Semiconductor, Aerospace, Space, Military, Medical, Automotive, Industrial and Commercial markets with our test services.

Integra offers these services from its locations in Wichita, Kansas and Albuquerque, NM and has earned an outstanding reputation for quality, technical expertise and on-time delivery.

Integra has one of the largest and most experienced test engineering organizations in the industry. We have the engineering expertise in house to support all technologies, including RF, digital, linear, analog mixed signal and memory.

Integra specializes in software development, hardware design and development, full production electrical test, qualification testing, failure analysis and destructive physical analysis.  Integra’s electrical test expertise encompasses both final test and wafer probe, including bumped wafer probe.

Military Test Expertise

Military Jet

Integra provides a comprehensive array of services to support Military/Space/Aerospace companies that require devices for use in applications that are more demanding than commercial or industrial devices are typically designed for - sometimes requiring higher security levels of ITAR and DOD-DMEA Trusted processing.

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Semiconductor Test Expertise

Semiconductor Test

Integra Technologies can support you with every post-wafer fabrication manufacturing service necessary to deliver a finished integrated circuit to your end customer!

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Featured Technology Solutions - Singulated Die Probe

Integra Technologies offers a complete suite of singulated die probing and testing services!

Bare die testing is essential for optimizing yields in the following applications: 

  • Multi-Chip Modules
  • System in Package
  • Die Reclamation and Repackaging
  • Hybrid Microcircuits
Integra die probing and testing capabilities include: Die Probe Interface
  • Die pad-counts from 2 to 8,000+
  • Temperatures from -55C to +125C
  • Device complexities from simple discretes to complex FPGAs & Microprocessors
  • Device speeds of 40GHz+
  • Minimal probe marks on pad
  • Precise micro manipulation for X, Y, Z and θ adjustment

Integra Technologies - Full Service Semiconductor Testing


Contact Us

Integra Technologies - Wichita
Semiconductor Development & Test Services 

3450 N. Rock Road, Building #100
Wichita, KS USA 67226 

Phone: (800) 622-2382
Fax:       (316) 630-6877


Analytical Solutions - Albuquerque
DPA & FA Services

10401 Research Rd. SE,
Albuquerque NM, 87123

Sales - (800) 622-2382

Technical Support - (505) 299-1967
Fax: (505) 292-0225 


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